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Advanced materials for thermal management of electronic packaging /
by Tong, Xingcun Colin.
Publication:
New York : Springer, 2011
. xxi, 616 p. :
25 cm.
Date:2011
Availability:
Copies available:
AUM Main Library
(2),
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Electrical conductive adhesives with nanotechnologies /
by Li, Yi.
Publication:
New York : Springer, 2010
. xii, 437 p. :
24 cm.
Date:2010
Availability:
Copies available:
AUM Main Library
(2),
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ASME _ Journal of electronic packaging.
Publication:
New York, N.Y. : American Society of Mechanical Engineers, 1989
. volumes :
, Title from cover.
29 cm.
Date:1989
Availability:
Copies available:
AUM Main Library
(1),
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No cover image available
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